Homepage for Course FYS4260/FYS9260
"Microsystems and Electronic
Packaging & Interconnection Technologies"
(In Norwegian: Mikrosystemer og elektronikk
byggemetoder)
Students of FYS4260 and
FYS9260 at University of Oslo this semester should use these web pages the
course room in Fronter (Click
here for Fronter
login) for downloading of course material, submission of project reports,
information exchange, etc.. For direct contact, please
send the e-mail to: Per.Ohlckers(at)fys.uio.no (Replace
"(at)" with the arrobe sign @ - done in
this way to reduce risk of spam. This applies to all e-mail addresses given
here)
Please click Timetable to
download the present version of the timetable for the latest semester. Please
be aware of possible changes during the semester, for instance if there is a
change of company visits.
Textbook:
Leif Halbo and
Per Ohlckers (Click
for homepage):
"Electronics Components, Packaging and
Production"
ISBN 82-992193-2-9
This textbook is used in
the course FYS4260/FYS9260 at University of Oslo in Norway, and in the course
ELBMT50 at Vestfold University College. The textbook
has been/is used at several other universities, for instance:
This textbook has been used
in the course 44130 at NTNU in Trondheim, Norway, at KTH (The Royal Institute
of Technology) in Stockholm, Sweden, at Chalmers University in Gothenburg,
Sweden, at Halmstad University in Halmstad,
Sweden, at Oregon Graduate Institute of Science and Technology in Oregon, USA,
and at Linkoping University, Campus Norrkoping, Sweden.
Download area:
These downloads are
formatted or tried to be formatted in the most accepted formats at date of
saving, for instance Word 2003(doc), PowerPoint 2003 (ppt)
and Portable Document Format (pdf). The
documents below are available in doc, ppt and pdf formats. For space and
transmission reasons the the files will later also be
made available as compressed (zipped) files. If you do not already have Adobe
Acrobat (Reader) installed on your computer,
please see the instructions below.
.pdf
files: In order to view documents in Portable Document Format, you will need to
download
the Adobe Acrobat Reader 3.0 or above (free of charge).
Please also note that
during peak hours (10:00 - 17:00 C.E.T.) the download time might be slow and we
therefore encourage users to try again at another time.
Please alert webmaster Per Ohlckers by e-mail if you have trouble downloading any of
the files:�� Per.Ohlckers(at)fys.uio.no
Another possible bug is that public reading access to the file(s) on the
download area of the web server may accidentally have been restricted.
Lecturing schedule for
FYS4260/FYS9260 course at the University of Oslo in spring semester year 2012: Timetable in
Rich Text Format. A list of obligatory preparations, Syllabus
(In English) for the final exam test is given.
PowerPoint presentations of
each chapter, as used during the lectures:
Chapter 1,
Chapter 2,
Chapter 3, Chapter
3 update 2009,
Chapter 4,
Chapter 5,
Chapter 6,
Chapter 6-2 High_Speed,
Chapter 7,
Chapter 8,
Chapter 9, and
Summary.
In addition, An introduction to Adhesives in Microelectronics and MEMS be found
in Adhesives,
an introduction to Green
Electronics, and a presentation of the development of SA30 Crash
Sensor can be downloaded. Warning: A lot graphics meaning a lot of MBytes - only download with high speed internet access. These PowerPoint presentations has been developed in INSIGHT
II, a European project sponsored by the EU programme Leonardo da Vinci. Also,
there are presentations on: Total Quality Management (TQM),
Statistical Process Control (SPC)
and Failure Mode and Effect Analysis (FMEA)
From the above given
PowerPoint presentations, the following are mandatory reading for FYS 4260
spring semester 2012 students: "Chapter 1" to "Chapter 9",
"Adhesives", Green Electronics", "TQM",
"SPC" and "FMEA". The "Summary" file is highly
recommended to identify the most important parts of the mandatory readings.
Also, a guide on Scientific
Writing can be downloaded by clicking here
for ppt version, or here
for pdf version.
or
here
for odp version. In the course projects, the reports
shall be written as scientific papers in the IEEE format, available in
different software formats like doc and LTex2e formats by downloading from IEEE
Author Digital Tool Box. The Word version can be downloaded by clicking
IEEE Journal Paper Template.
In addition, an informal
guide by S. Senturia can be downloaded here.
Presentations from the
STIMESI-II Course part (Used at SINTEF MiNaLab on March 15,
2012, and at regular lectures in
2013):
Generic MEMS technology:
SensoNor technology descriptions (Obligatory
reading for spring 2013 students):
7-MMPart1(Introduction).ppt
8-MPart2(MPW_Process_Description I).ppt
10-MMPart4(MPW_Process_Description_II).ppt
Tronic's technology
descriptions (Obligatory reading for spring 2013 students):
TRONICS_MEMSOI Course2.ppt.
STIMESI Hands-On Training Material can be downloaded by clicking here.
Presentation of MiNaLab (NOT obligatory
reading for spring 2013 students):
16-MiNaLab_presentation_07.pdf
Additional PowerPoint
presentations (NOT obligatory reading for spring 2013 students):
More information on High Frequency Design can be found in High
Speed Course.
More information on High Frequency Design and Flex Prints can be found in Chapter 6.7-6.10.
An introduction to Cooling of Electronics can be found in Intro_Cooling
(Sorry, only a Norwegian version yet)
Frode Strisland
lectures 2006.
(NOT obligatory reading for spring 2013 students):
: CH3_Materialer_2006.pdf
and CH8_Keramikkhybrider_2006.pdf
(Norwegian text)
An example of a project
presentation by earlier students can be downloaded here: Babycall.zip
Videos:
The video
for the textbook and FYS4260 course: "An Introduction to Electronic
packaging and Interconnection Technologies":
FYS4260IntroVideo.mp4
Warning: 176 MBytes!
From
DuPont on Multilayer Ceramic Technology:
If
you are using software with a DVD Codec:
http://www.fys.uio.no/studier/kurs/fys4260/DuPont_Video.zip
Unzip and start by launching the file VIDEO_TS.IFO. Warning:
415 MBytes unzipped!
If If you are using software that can
play MPEG4:
DuPont.avi Warning: 191 MBytes!
From
SensoNor: Their marketing movie on their microsystem
technologies can be downloaded as mp4 file:
Sensonor.mp4
Warning: 43 MBytes!
From
ESEC: Their marketing video shows the power of highly automated electronic
packaging technology:
If If you are using software that can play MPEG4:ESEC_FYS4260Video.mp4 Warning: 176 MBytes!
or avi format: ESEC_FYS4260Video.avi Warning: 62 MBytes!
Below follows a download
area with restricted access:
All or some of these files
have password protection to protect them from unauthorized use. The password
protected documents should only be downloaded and used based upon an agreement
with Per Ohlckers regulating the use.
The textbook is also
available as a set of word files of the different parts or chapters (Word 2000
and up): Front
Page of the book (306 k), Back Page (22
k), Book
Shoulder (20 k) Introduction
(58 kb) including Table of Contents, Chapter 1 (131
kb), Chapter 2
(9,5 Mb), Chapter
3 (3,6 Mb), Chapter
4 (5.2 Mb), Chapter
5 (4,5 Mb), Chapter
6 (4,6 Mb), Chapter
7 (8,7 Mb), Chapter
8 (3,9 Mb) and Chapter 9
(22,6 Mb). Be warned: A lot of graphics meaning a lot MBytes
- only download with high speed internet access. These files can be downloaded
free of charge., but please refer to the book or the
source material used in the book if used in any publications.
The textbook is also
available as a set of Portable Document Format (pdf)
files of the different parts or chapters (Use for instance Adobe Acrobat Reader
to view these files): Front Page
of the book (375 k), Back Page
(51 k), Book
Shoulder (31 k) Introduction
(103 kb) including Table of Contents, Chapter 1
(122 kb), Chapter
2 (6,5 Mb), Chapter 3
(3,5 Mb), Chapter
4 (6,4 Mb), Chapter 5
(5,7 Mb), Chapter
6 (4,5 Mb), Chapter 7
(11,3 Mb), Chapter
8 (4,4 Mb) and Chapter 9
(11,3 Mb). Be warned: A lot of graphics meaning a lot MBytes
- only download with high speed internet access. These files can be downloaded
free of charge., but please refer to the book or the
source material used in the book if used in any publications.
End of download area with
restricted access.
Course FYS317/3260/4260
tests
Word files of course FYS317
tests given at University of Oslo during the last years: Test 94, Test 95, Test 96, Test 97, Test 98, Test 99, Test 00, Test 01, Test 02, Test 03, Test 04, Test 05, Test06, Test07, Test08, Test09, Test10, Test11, Test12 and
Test13. These
can be used as Hands-on exercises.
Guide to answers some of
these tests: Guide
94, Guide
97, Guide
99, Guide
00, Guide
01, Guide
02, Guide
03, Guide
04, Guide 05,
Guide
06, Guide
07 , Guide
08, Guide
09, Guide10
and Guide11,
Guide12.
It is strongly recommended
that the students as a preparation for the test try solve tests from earlier
years. In this way they will be familiar with the typical way tests are made,
at least as long as Per Ohlckers is main lecturer.
They will also get a better understanding of which parts of the course that are
considered most important. The tests are made to make the sensor best possible
able to distinguish the competence level between the students. The easiest
questions shall show whether the student has minor basic understanding of the
field. The most difficult questions shall show which students should get top
score because they have a thorough in-depth understanding and knowledge in the
field to describe the different technologies accurately and to assess them
compared to related technologies, as well as know important more detailed
matters, such as material properties etc. In between the easy and the most
difficult questions there will be questions ranging from modest easy to modest
difficult. A good test tactic is to set your score ambition level during the
preparation, and first start to acquire a basic knowledge, understanding and
overview of the field, and then dive into more thorough and detailed matters.
For instance, being able to describe thick film technology and compare it with
thin film technology is the kind of knowledge you should be familiar with
before you start with more detailed matters, like for instance being able to do
comparisons of dielectric constants of frequently used materials.
Abstract of book
The book is primarily meant
for university education in introductory electronic packaging technology. An
overview is given, that encompasses materials aspects, metallurgy, chemistry,
physical, and mechanical properties. An understanding of the interplay of all
these basic fields is necessary for choosing and using the available packaging
technologies optimally, making a good design that can result in a product with
the right quality. Component technologies are described, basic processing methods,
printed wiring boards, design guidelines, the production of printed circuit
boards and the common hybrid technologies, including multichip modules.
The book is based on a
course presented at the University of Oslo over the last 6 years. It is written
with financial support from the European COMETT program, as part of the project
COMETT INSIGHT.
The first edition was
published in 1993. The most important change in this revised edition from 1995
is an additional chapter on micromachined devices.
(Chapter 9) The other chapters have only minor changes.
Table of Contents
If you click on the
specific chapters that are marked as available html files on the web,
you may have a closer look. Warning: You should only do this if you have a high
speed internet access, as these files are loaded with links to large sized
figure files, calling for several Mbytes to be transmitted.
Chapter 1:
INTRODUCTION
Chapter 2:
TECHNOLOGIES FOR ELECTRONICS - OVERVIEW
Chapter 3:
MATERIALS AND BASIC PROCESSES
Chapter 4: COMPONENTS FOR
ELECTRONIC SYSTEMS
Chapter 5: PRINTED WIRING
BOARD
Chapter 6: PCB DESIGN
Chapter 7: PRODUCTION OF
PRINTED CIRCUIT BOARDS
Chapter 8: HYBRID
TECHNOLOGY AND MULTICHIP MODULES
Chapter 9:
MICRO STRUCTURE TECHNOLOGY AND MICROMACHINED DEVICES
Hard copies available as a
paperbacks for a price of NOK 150,- per copy from:
Per Ohlckers,
Department of Physics, University of Oslo, P.O.Box
1048, Blindern, N-0316 Oslo.
An introduction video is
available. Lecturing transparencies are available for lecturers, either by
downloading from this web site, or as printouts on terms to be agreed on.
E-mail ordering: Send
E-mail to Per Ohlckers by clicking at his E-mail
address: Per.Ohlckers(at)fys.uio.no
Sponsors
The FYS317 Course at the
University of Oslo is for the spring semesters of 2000, 2002 and 2003 sponsored
by SINTEF
Instrumentation and Microelectronics. If you want to know more of their contract
research capabilities, please go to their web site by clicking on the SINTEF
logo below.
You may also contact
Research Manager Ole Christian Bendixen by clicking
at his E-mail address: Ole.C.Bendixen(at)sintef.no
The microsystem company
Diamond Nanomachines as ,
earlier Fifty four point Seven as, has also sponsored this course at the
University of Oslo. Please go to their web page for more information by
clicking their logo. (Not active by November 2011)
The
research programs COMETT and Leonardo da Vinci of the of
the European Union have sponsored the textbook and transparency series
developments. The Norwegian Research Council has sponsored the textbook
development.
Back to the top
of "Electronic Components, Packaging and Production"
To the homepage of Per Ohlckers
End of page