FYS 4310/9310 TENTATIVE WEEKLY PLAN 2019

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NB always Tentative/ preliminary

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Week

Dates

"Problem solving exercises"

Lecture

1,2

all
Get text-book and curriculum
NO LECTURE

3

17 jan

No problems

Overview; Unity-processes, Device technologies,Solid state physics, Xtals, Xtal defects, Charged vacancy model Si, Si purification, Xtal growth, Segregation

4

21 jan

Problem 200.1 .. 200.7

,Xtal growth, Oxygen in Si, Denuded zone, Gettering,
Unit process Epitaxi, CVD, MBE,

5

28 jan

Problems 200 -8, -9, -13, -18, -19,

Unit process Epitaxy, MBE, SPE, Case GaAs on Si, SiGe,

6

4 Feb

1400-1 , -2, -4,-10,-9 (,-6 ) Oblig1[ 200-10, -15,-20, 1400-3, -5 ] [200-11, 200-12]

Unit process Oxidation

7

11 feb

Oblig 1 discuss

Unit process Diffusion

8

18 feb

do Summary_test 1, at 'home'

Unit process Diffusion

9

25 feb

Problems , 300-2, -6 Discuss Quiz_1,

Unit process Ion implantation,

10

4 mar

Problem 300-6, 7,-8, -9; 400-6,-7,-8

Ion implantation, RTP, Rep.

11

11 mar

Oblig 2[300-3, -10, 400-3. 500-2, 500-3 [300-1,300-5]
Pattern transfer,Wet- Dry-etching, Sputtering,

12

18 mar

Oblig 2 discuss,

Technical education, Vacuum, Plasma, Thin Film deposition

13

25 mar

500-6, -7, 600-1 ,-3 Unit Matalization, Thin Film inter-diffusion,

14

1 april
do Summary_test2, at 'home', poly Si, Unit process pattern transfer, lithography

15 8 apr
discuss test 2
Process Integration, Isolation

16

15 apr

   EASTER

EASTER

17
22 apr
EASTER

EASTER

18

29 apr

do oblig3: [ 800-1, 900-1, 900-2, 1500-1,1500-4, 1500-5] [1500-2, 1500-3]
Process Integration, Bipolars, s

19

6 may
discuss oblig 3
Process Integration MOS, CMOS

20

13 may

do repetitions 1500-6..8, 300-4, 400-1,-2, -10,    at home

MEMS  Process Integration

21

20 may
TBD TBD

22

27 may

TBD

Project presentations - 20 min pr person .

23
3 june
Oral Exam (Individual Time Schedule announce Later)
23 10 Jun Reading for fun and pleasure with no pressure! readbooks

Week	Dates	"Problem solving exercises"	Lecture
1,2	all	Get text-book and curriculum	NO LECTURE
3	17 jan	No problems	Overview; Unity-processes, Device technologies,Solid state physics, Xtals, Xtal defects, Charged vacancy model Si, Si purification, Xtal growth, Segregation
4	21 jan	Problem 200.1 .. 200.7	,Xtal growth, Oxygen in Si, Denuded zone, Gettering, Unit process Epitaxi, CVD, MBE,
5	28 jan	Problems 200 -8, -9, -13, -18, -19,	Unit process Epitaxy, MBE, SPE, Case GaAs on Si, SiGe,
6	4 Feb	1400-1 , -2, -4,-10,-9 (,-6 ) Oblig1[ 200-10, -15,-20, 1400-3, -5 ] [200-11, 200-12]	Unit process Oxidation
7	11 feb	Oblig 1 discuss	Unit process Diffusion
8	18 feb	do Summary_test 1, at 'home'	Unit process Diffusion
9	25 feb	Problems , 300-2, -6 Discuss Quiz_1,	Unit process Ion implantation,
10	4 mar	Problem 300-6, 7,-8, -9; 400-6,-7,-8	Ion implantation, RTP, Rep.
11	11 mar	Oblig 2[300-3, -10, 400-3. 500-2, 500-3 [300-1,300-5]	Pattern transfer,Wet- Dry-etching, Sputtering,
12	18 mar	Oblig 2 discuss,	Technical education, Vacuum, Plasma, Thin Film deposition
13	25 mar	500-6, -7, 600-1 ,-3	Unit Matalization, Thin Film inter-diffusion,
14	1 april	do Summary_test2, at 'home',	poly Si, Unit process pattern transfer, lithography
15	8 apr	discuss test 2	Process Integration, Isolation
16	15 apr	EASTER	EASTER
17	22 apr	EASTER	EASTER
18	29 apr	do oblig3: [ 800-1, 900-1, 900-2, 1500-1,1500-4, 1500-5] [1500-2, 1500-3]	Process Integration, Bipolars, s
19	6 may	discuss oblig 3	Process Integration MOS, CMOS
20	13 may	do repetitions 1500-6..8, 300-4, 400-1,-2, -10, at home	MEMS Process Integration
21	20 may	TBD	TBD
22	27 may		TBD Project presentations - 20 min pr person .
23	3 june	Oral Exam	(Individual Time Schedule announce Later)
23	10 Jun	Reading for fun and pleasure with no pressure!